NOTICE OF PROPOSED FEDERAL RECEIVER SALE OFREAL PROPERTY AND EQUIPMENT OF LA SEMICONDUCTOR, LLC United States District Court Northern District of Ohio, Eastern Division Civil Case No. 5:24-cv-2215 Chief Judge Sara Lioi Please take notice that the Court-appointed Receiver in the above-referenced case, with the assistance of Macquarie Semiconductor & Technology, Inc., intends to conduct a public sealed-bidding sale, subject to Court approval, of LA Semiconductor, LLC's ("LAS") wafer fabrication facility and equipment located at 2300 W. Buckskin Road, Pocatello, Idaho 83201 (the "Receivership Property"). The Receiver has filed a Motion for Entry of an Order (1) Approving Public Sale Procedures; (2) Authorizing the Receiver to Sell the Receivership Property Free and Clear of Liens, Claims, and Encumbrances; and (3) Approving Other Matters Related to the Sale of the Receivership Property (the "Motion"). The Motion is presently pending before the Court. The legal description of the real estate along with an itemized list of the assets being sold are set forth in the Motion at Exhibit C. Additionally, the procedures and requirements governing the proposed bid process and sale of the Receivership Property are more fully described in the Motion and Exhibits A & B thereto. Any interested party is encouraged to carefully review the Motion and the bid procedures and requirements set forth therein. A copy of the Motion is accessible on the LAS Receiver website: https://www.lasreceiver.com/. Any future Orders from the Court pertaining to the bidding and sale process will be uploaded and available for viewing on the LAS Receiver website. The proposed bidding and sale process sets forth a Sealed Bid Deadline of December 19, 2025. For any additional inquiries, please contact: Brian Lee Associate Director, MacQuarie +1 (858) 951-2167 brian.lee@macquarie.com Thomas Luscher Associate Director, MacQuarie +1 (858) 705-4515 thomas.luscher@macquarie.com IPL0290103 Nov 21,28,Dec 5,12 2025